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this is information on a product in full production. march 2014 docid17793 rev 3 1/13 ECMF04-4AMX12 common mode filter with esd protection for mipi d-phy and mddi interface datasheet - production data figure 1. pin configuration (top view) features ? very large differential bandwidth > 6 ghz ? high common mode attenuation: ? -34 db at 900 mhz ? -20 db between 800 mhz and 2.2 ghz ? very low pcb space consumption ? thin package: 0.6 mm max ? lead-free package ? high reduction of parasitic elements through integration complies with the following standards: ? iec 61000-4-2 level 4 input and output pins: ? 15 kv (air discharge) ? 8 kv (contact discharge) applications ? mobile phones ? notebook, laptop ? portable devices ? pnd description the ECMF04-4AMX12 is a highly integrated common mode filter designed to suppress emi/rfi common mode noise on high speed differential serial buses like mipi d-phy or mddi. the ECMF04-4AMX12 can protect and filter 2 lanes. qfn-12l esd esd esd esd esd esd esd esd d0- d0+ nc gnd1 gnd0 nc d0- d0+ d1+ d1+ d1- d1- www.st.com
characteristics ECMF04-4AMX12 2/13 docid17793 rev 3 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage (1) iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 8 20 kv i dc maximum dc current 200 ma t op operating temperature -40 to +85 c t j maximum junction temperature 125 c t stg storage temperature range - 55 to +150 c 1. measurements done on iec 61000-4-2 test bench. fo r further details see application note an3353. table 2. electrical characteristics (values, t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 6 v i rm v rm = 1.5 v per line 100 na r dc dc serial resistance 1.8 2.5
docid17793 rev 3 3/13 ECMF04-4AMX12 characteristics 13 figure 7. s cc41 / s cc23 inter-lane common-mode cross-coupling measurements (z 0 com = 50 ) figure 3. s dd21 differential attenuation measurements (z 0 diff = 100 ) figure 4. s cc21 common mode attenuation measurements (z 0 com = 50 ) 300k 1m 3m 10m 30m 100m 300m 1g 3g - 3 - 2.8 - 2.6 - 2.4 - 2.2 - 2 - 1.8 - 1.6 - 1.4 - 1.2 - 1 - 0.8 - 0.6 - 0.4 - 0.2 0 f(hz) db 300k 1m 3m 10m 30m 100m 300m 1g 3g - 36 - 34 - 32 - 30 - 28 - 26 - 24 - 22 - 20 - 18 - 16 - 14 - 12 - 10 - 8 - 6 - 4 - 2 0 f(hz) db figure 5. s dd11 , s dd22 differential return loss measurements (z 0 diff = 100 ) figure 6. s dd41 / s dd23 inter-lane differential cross-coupling measurements (z 0 diff = 100 ) 300k 1m 3m 10m 30m 100m 300m 1g 3g -40 -35 -30 -25 -20 -15 -10 -5 0 s dd11 s dd22 f(hz) db 300k 1m 3m 10m 30m 100m 300m 1g 3g - 110 - 100 - 90 - 80 - 70 - 60 - 50 - 40 - 30 - 20 - 10 f(hz) 0 db 300k 1m 3m 10m 30m 100m 300m 1g 3g - 100 - 90 - 80 - 70 - 60 - 50 - 40 - 30 - 20 - 10 f(hz) 0 db
characteristics ECMF04-4AMX12 4/13 docid17793 rev 3 figure 10. mipi d-phy low power mode test setup figure 11. low power pulse response - see figure 10 for test setup figure 8. esd response to iec 61000-4-2 (+8kv contact discharge) figure 9. esd response to iec 61000-4-2 (-8kv contact discharge) 20 v/div 20 ns/div 50 v/div 20 ns/div pin 12 pin 11 c2 c3 v= 82v peak v = 110 v peak pin 11 20 v/div 20 ns/div 50 v/div 20 ns/div c2 c3 v = -70 v peak pin 12 v = -115 v peak generator agilent 81110 pattern mode, f=10mhz, modulation rz, 50 output cmf oscilloscope lecroy 7300a, 1m input 500 mv/div 500 mv/div 200 ns/div 200 ns/div pulse: 50 ns, t r = t f = 5 ns
docid17793 rev 3 5/13 ECMF04-4AMX12 application information 13 2 application information figure 12. application information camera application baseband data n+ csi transmitter data n - gnd data 1+ data 1- gnd clock + clock - gnd data n+ csi receiver data n - gnd data 1+ data 1- gnd clock + clock - gnd cci master cci slave scl sda scl sda ECMF04-4AMX12 emif02-1003m6 ecmf02-2amx6 d1+ gnd1 gnd0 d1- d1+ d1- nc nc d0+ d0- d0+ d0- 1 3 2 4 6 5 d+ d+ d- d- gnd nc gnd gnd in in out out
ordering information scheme ECMF04-4AMX12 6/13 docid17793 rev 3 3 ordering information scheme figure 13. ordering information scheme package yy = number of filtered lines a = version number of esd protected lines function number of filtered lines version common mode filter with esd protection 4 = 4 lines with esd protection mx12 = qfn-12l, pitch 500 m, 12 = 12 pads ecmf yy - x a mx12
docid17793 rev 3 7/13 ECMF04-4AMX12 package information 13 4 package information ? epoxy meets ul94, v0 ? lead-free packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. note: product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. table 3. qfn-12l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.51 0.55 0.6 0.020 0.022 0.024 a1 0 0.02 0.05 0.000 0.001 0.002 b 0.18 0.25 0.3 0.007 0.010 0.012 d 3.25 3.3 3.35 0.128 0.130 0.132 e 1.45 1.5 1.55 0.057 0.059 0.061 e 0.45 0.5 0.55 0.018 0.020 0.022 l 0.3 0.4 0.5 0.012 0.016 0.020 figure 14. footprint (dimensions in mm) figure 15. marking l b e e a a1 side view top view d kc
package information ECMF04-4AMX12 8/13 docid17793 rev 3 figure 16. qfn-12l tape and reel specification user direction of unreeling all dimensionare typical values in mm 4.0 12.00 1.75 5.5 ? 1.55 0.80 1.70 3.70 4.0 dot identifying pin a1 location 2.0 kc kc kc
docid17793 rev 3 9/13 ECMF04-4AMX12 recommendation on pcb assembly 13 5 recommendation on pcb assembly 5.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 17. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for leads: opening to footprint ratio is 90%. figure 18. recommended stencil window position l t w aspect ratio w t ----- 1 . 5 = aspect area lw 2t l w + () --------------------------- - 0.66 = 236 m 570 m 250m 600 m 7 m 15 m stencil window footprint
recommendation on pcb assembly ECMF04-4AMX12 10/13 docid17793 rev 3 5.2 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. use solder paste with fine particles: powder particle size 20-45 m. 5.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 5.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
docid17793 rev 3 11/13 ECMF04-4AMX12 recommendation on pcb assembly 13 5.5 reflow profile figure 19. st ecopack? recommended sold ering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 5.6 layout recommendation connection to pcb gnd must be as short as possible to ensure esd remaining voltage and s cc21 performance. figure 20. layout recommendation 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max vias to gnd plane zdiff according to the application
ordering information ECMF04-4AMX12 12/13 docid17793 rev 3 6 ordering information for the latest information on available order codes see the product pages on www.st.com. 7 revision history table 4. ordering information order code marking package weight base qty delivery mode ECMF04-4AMX12 kc (1) 1. the marking can be rotated by 90 to differentiate assembly location qfn-12l 7.25 mg 3000 tape and reel 7? table 5. document revision history date revision changes 10-aug-2010 1 initial release. 28-jun-2011 2 added complies with the following standards: and air discharge parameter in table 1 . 14-mar-2014 3 corrected typographical error in description .
docid17793 rev 3 13/13 ECMF04-4AMX12 13 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com

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